PASTE INSPECTION 3D

PARMI SPI-3D

Pattern Recognition and Machine Intelligence

World leader in measuring the solder paste printing 3D SPI

• Detailed and fast measurement
• Dual Laser Technology
• Wide bandwidth
• Wide compatibility of materials
• High image quality
• PCB bending correction in real time
• High precision motion control
• Direct connection to the screen printer
• Process control / correction
• The measurement basis for each deposit of paste

Sigma X vs HS70

SIGMA X ORANGE

• Fastest inline SPI on the market
• 100cm2/s with a resolution of 10×10 µm
• PCB: 50 x 50 mm – 580 x 510 mm

SIGMA-X BLUE

• Budgets version of the SIGMA-X
• 60cm2/s with a resolution of 10×10 µm
• PCB: 50 x 50 mm – 480 x 350 mm

SPI HS70

• Inline SPI, can work in dual-line
• 80 cm2/s with a resolution of 10×10 µm
• PCB: 80 x 80mm – 950 x 670 mm

SPI 50T

• Automatic benchtop SPI
• 100cm2/s with a resolution of 13×13 µm
• PCB max – 330 mm x 250 mm

SPI 2500

• Semi-automatic benchtop SPI
• 30 profili/s with a resolution of 10 µm
• PCB max – 520 mm x 400 mm

Machine brochures for download

PARMI HS60 HS70
SIGMA X EN

WWW

http://parmi.com/parmi/eng/content/products_eng/worldclass_eng