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  • +48 55 261 90 09

  • office@cps.com.pl

  • Mareza, ul. Długa 47, 82-500 Kwidzyn

PASTE INSPECTION 3D

PARMI SPI-3D

Pattern Recognition and Machine Intelligence

World leader in measuring the solder paste printing 3D SPI

  • Detailed and fast measurement
  • Dual Laser Technology
  • Wide bandwidth
  • Wide compatibility of materials
  • High image quality
  • PCB bending correction in real time
  • High precision motion control
  • Direct connection to the screen printer
  • Process control / correction
  • The measurement basis for each deposit of paste

 

Sigma X vs HS70

SIGMA X ORANGE

  • Fastest inline SPI on the market
  • 100cm2/s with a resolution of 10×10 µm
  • PCB: 50 x 50 mm – 580 x 510 mm

SIGMA-X BLUE

  • Budgets version of the SIGMA-X
  • 60cm2/s with a resolution of 10×10 µm
  • PCB: 50 x 50 mm – 480 x 350 mm

SPI HS70

  • Inline SPI, can work in dual-line
  • 80 cm2/s with a resolution of 10×10 µm
  • PCB: 80 x 80mm – 950 x 670 mm

SPI 50T

 

  • Automatic benchtop SPI
  • 100cm2/s with a resolution of 13×13 µm
  • PCB max – 330 mm x 250 mm

SPI 2500

  • Semi-automatic benchtop SPI
  • 30 profili/s with a resolution of 10 µm
  • PCB max – 520 mm x 400 mm

Machine brochures for download

PARMI HS60 HS70
SIGMA X EN

WWW

http://parmi.com/parmi/eng/content/products_eng/worldclass_eng

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