This compact modular in-line system ulitises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single soldering unit with on-board fluxing and preheat functions. It also provides a reduced footprint and cost savings over the conventional three module, fluxing, preheat and selective soldering work cell.
Description
The fluxer/preheat combo operates in tandem with the selective soldering unit and can be configured with either Drop-Jet or ultrasonic flux heads and both top and bottom side IR preheat functions. Twin pitch fluxheads are available for further cycle time reductions.
The machine utilizes an XY positioning system to position the flux head as required. A Drop-Jet flux head is supplied as standard with an ultrasonic head being ordered as an alternative or in addition to the standard head. Both systems provide precise control of the flux being deposited on the board.
Programming and control of the machine is via a PC using the Windows® based PillarCOMM software. Programs and machine configuration are protected by a customer selectable, multilevel password security system.
The machine is freely programmable to cater to different board layouts. Each flux joint is separately programmable to its own set of required parameters. The programming system employs a component data library enabling quantities of similar joints to use the same fluxing data outline. Visually assisted self-teach alignment allows for fast and accurate board programming.
Standard Features
In-line motor driven auto width adjust – through feed synchronous movement conveyor
Conveyor side clamping
Integral PC and machine mounted TFT monitor
Drop-jet fluxer
Internal fume extraction
Colour programming camera
PillarCOMM Windows® based ‘Point & Click’ interface
Light stack
Flux level sensor
SMEMA compatible
Multiple level password protection
Day-to-day service kit
Monitoring Options
Flux presence sensor – thermistor style
Flux spray monitoring
Flux flow monitoring
Flux spray & flow monitoring
System Options
Ultrasonic fluxing
Dual drop-jet / ultrasonic fluxing
Top-side instant IR preheat
Pyrometer closed loop temperature control
Encoders on X, Y and Z axis
Specifications
Height: 1615mm / 63” – excluding light stack
Width: 813mm / 32“
Depth: 2024mm / 80”
Board size: Max. – 457mm x 610mm / 18”x 24”
Min. – 102mm x 102mm / 4”x 4”
Flexible, in-line, modular selective soldering system
Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high speed throughput when multiple modules are placed together.
Description
Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side preheat function. Preheat can be controlled via an optional top-side closed loop pyrometer system for optimum temperature profile regulation.
Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology single point AP nozzle design incorporating patented spiral solder return to bath technology offering increased wave stability with reduced potential for solder balls.
The system can also accommodate our latest generation micro nozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.
As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local preheat to the joint thus reducing thermal shock to localised components.
The Synchrodex is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.
Standard Features
In-line motor driven auto width adjust through feed synchronous movement conveyor
Conveyor side clamping
Integral PC and machine mounted TFT monitor
Auto solder wire feed and level detect
Heated inerted Nitrogen system
Drop-Jet fluxer
Set of AP solder nozzle tips
Internal fume extraction
Colour programming camera
Windows® based PillarCOMM ‘Point & Click’ interface
Light stack
Fiducial recognition and correction system
Flux level sensor
Multiple level password protection
PillarPAD offline programming system
SMEMA compatible
Process viewing camera with record feature
Lead-free capability
Day-to-day service kit
Monitoring Options
Flux presence sensor – thermistor style
Flux spray, flow and spray & flow
Pump rpm
O2 ppm
Nitrogen flow
System Options
Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Top-side instant IR preheat
Closed loop pyrometer temperature control
Solder wave height measurement and correction system
Bottom-side hot Nitrogen selective preheat
Laser PCB warp correction
Solder reel identification
Solder bath coding – identifies correct bath for program
Encoders on X, Y and Z axis
Nitrogen generator
Specifications
Height: 1615mm / 63” – excluding light stack
Width: 813mm / 32“
Depth: 2024mm / 80”
Board size: Max. – 457mm x 610mm / 18”x 24”
Min. – 102mm x 102mm / 4”x 4”
High speed, in-line, multi-platform selective soldering system
Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
The standard four station cell can be configured to handle PCB’s up to 381mm x 460mm – fluxer, preheat, solder, solder. For high speed applications this same unit can be configured as fluxer/preheat and up to three solder modules with as many as five heater options.
Description
Product Description
An optional PCB transfer station and return conveyor enables product to be manually unloaded adjacent to the conveyor load station – this configuration reduces PCB handling capability to 381mm x 250mm.
Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.
Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.
Standard Features
In-line motor driven width adjust through feed conveyor
Conveyor side clamping
DC servo drives with encoders on X, Y & Z axis
Integral PC and machine mounted TFT monitor
Inerted Nitrogen system
Automatic fiducial correction system
Motorised wire feed auto solder top-up & solder level detect
Drop-Jet fluxer
Solder wave height measurement and correction system
Process viewing camera
Multiple level password protection
Solder bath coding – identifies correct bath for program
Thermal nozzle calibration system using integrated setting camera (requires manual correction)
Six AP solder nozzle tips
Internal fume extraction
Colour programming camera
PillarCOMM Windows® based ‘Point & Click’ interface
PillarPAD offline programming system
Lead-free compatible
Day-to-day service kit
Monitoring Options
Flux presence sensor – thermistor style
Flux spray, flow and spray & flow
Pump rpm
O2 ppm
Nitrogen flow
System Options
Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Top-side instant IR preheat
Bottom-side IR preheat
Closed loop pyrometer temperature control
Large solder bath for dedicated single dip applications
Laser PCB warp correction
1.5mm micro nozzle
Solder reel identification
Larger PCB handling size
Nitrogen generator
Specifications
Height: 1390mm / 55” to 2045mm / 80½”- with light stack
Width: 2193mm / 86½“ Compact
2930mm / 115½” Standard
Depth: 1520mm / 60”
1740mmm / 68½” with flux bottles
Board size: 381mm x 460mm / 15”x 18” (Standard frame with 4 stations)
Larger PCB size available upon request
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 20kg standard – 30kg large bath
Applicators: AP style – 2.5 – 16mm dia.
Extended and Jet-Tip nozzles – up to 25mm dia.
Jet-Wave nozzles – up to 25mm width
Special dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution: 0.15mm
Repeatability: +/- 0.05mm
Nitrogen usage: 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar / 72 psi
Power supplies: Three-phase + neutral + PE
Voltage: 230 V phase to neutral / 400V phase to phase
Frequency: 50/60Hz
Power : Machine configuration dependent – contact your local Pillarhouse representative
Transport: Motorised conveyor
Programming: PillarCOMM Windows® based ‘Point & Click’ interface
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