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Orissa Synchrodex Combo

In-line or stand-alone fluxer / preheater

This compact modular in-line system ulitises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single soldering unit with on-board fluxing and preheat functions. It also provides a reduced footprint and cost savings over the conventional three module, fluxing, preheat and selective soldering work cell.

Description

The fluxer/preheat combo operates in tandem with the selective soldering unit and can be configured with either Drop-Jet or ultrasonic flux heads and both top and bottom side IR preheat functions. Twin pitch fluxheads are available for further cycle time reductions.

The machine utilizes an XY positioning system to position the flux head as required. A Drop-Jet flux head is supplied as standard with an ultrasonic head being ordered as an alternative or in addition to the standard head. Both systems provide precise control of the flux being deposited on the board.

Programming and control of the machine is via a PC using the Windows® based PillarCOMM software. Programs and machine configuration are protected by a customer selectable, multilevel password security system.

The machine is freely programmable to cater to different board layouts. Each flux joint is separately programmable to its own set of required parameters. The programming system employs a component data library enabling quantities of similar joints to use the same fluxing data outline. Visually assisted self-teach alignment allows for fast and accurate board programming.

Standard Features

  • In-line motor driven auto width adjust – through feed synchronous movement conveyor
  • Conveyor side clamping
  • Integral PC and machine mounted TFT monitor
  • Drop-jet fluxer
  • Internal fume extraction
  • Colour programming camera
  • PillarCOMM Windows® based ‘Point & Click’ interface
  • Light stack
  • Flux level sensor
  • SMEMA compatible
  • Multiple level password protection
  • Day-to-day service kit

Monitoring Options

  • Flux presence sensor – thermistor style
  • Flux spray monitoring
  • Flux flow monitoring
  • Flux spray & flow monitoring

System Options

  • Ultrasonic fluxing
  • Dual drop-jet / ultrasonic fluxing
  • Top-side instant IR preheat
  • Pyrometer closed loop temperature control
  • Encoders on X, Y and Z axis

Specifications

  • Height: 1615mm / 63” – excluding light stack
  • Width: 813mm / 32“
  • Depth: 2024mm / 80”
  • Board size: Max. – 457mm x 610mm / 18”x 24”
    Min. – 102mm x 102mm / 4”x 4”
  • Edge clearance: Above/below 3mm
  • Height clearance: Below 40mm – above 45mm
    100mm – upon request
  • Extraction: Fan: 276mm dia.
  • Rating: 1000m3/hr / 589 CFM
  • Flux: Low maintenance Drop-Jet system. Low solids, no clean flux, pressurised and inerted system, optional water soluble system available.
  • Flux tank capacity: 1 litre
  • Fluxer speed: 50 dots/second
  • Deposition size: 4.0-6.0mm / 0.16-0.24”
  • X, Y & Z axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm.
  • Nitrogen supply pressure: 5 bar / 72 psi
  • Nitrogen usage: 10-30 litres/min.
  • Air Supply Pressure: 5 bar / 72 psi
  • Air Usage: 10 litres/min. / 0.35CFM
  • Power Supplies: 1 phase + PE.
  • Voltage: 230V
  • Frequency: 50/60 Hz.
  • Power: 13kVA max. – machine configuration dependent
  • Transport: Conveyor
  • Programming: PillarCOMM Windows® based ‘Point & Click’ interface

Orissa Synchrodex

Flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high speed throughput when multiple modules are placed together.

Description

Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side preheat function. Preheat can be controlled via an optional top-side closed loop pyrometer system for optimum temperature profile regulation.

Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology single point AP nozzle design incorporating patented spiral solder return to bath technology offering increased wave stability with reduced potential for solder balls.

The system can also accommodate our latest generation micro nozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local preheat to the joint thus reducing thermal shock to localised components.

The Synchrodex is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

  • In-line motor driven auto width adjust through feed synchronous movement conveyor
  • Conveyor side clamping
  • Integral PC and machine mounted TFT monitor
  • Auto solder wire feed and level detect
  • Heated inerted Nitrogen system
  • Drop-Jet fluxer
  • Set of AP solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • Windows® based PillarCOMM ‘Point & Click’ interface
  • Light stack
  • Fiducial recognition and correction system
  • Flux level sensor
  • Multiple level password protection
  • PillarPAD offline programming system
  • SMEMA compatible
  • Process viewing camera with record feature
  • Lead-free capability
  • Day-to-day service kit

Monitoring Options

  • Flux presence sensor – thermistor style
  • Flux spray, flow and spray & flow
  • Pump rpm
  • O2 ppm
  • Nitrogen flow

System Options

  • Ultrasonic fluxing
  • Dual Drop-Jet / ultrasonic fluxing
  • Top-side instant IR preheat
  • Closed loop pyrometer temperature control
  • Solder wave height measurement and correction system
  • Bottom-side hot Nitrogen selective preheat
  • Laser PCB warp correction
  • Solder reel identification
  • Solder bath coding – identifies correct bath for program
  • Encoders on X, Y and Z axis
  • Nitrogen generator

Specifications

  • Height: 1615mm / 63” – excluding light stack
  • Width: 813mm / 32“
  • Depth: 2024mm / 80”
  • Board size: Max. – 457mm x 610mm / 18”x 24”
    Min. – 102mm x 102mm / 4”x 4”
  • Edge clearance: Above/below 3mm
  • Height clearance: Below 40mm – above 45mm
    100mm – upon request
  • Extraction: Fan: 276mm dia.
  • Rating: 1000m3/hr / 589 CFM
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 15kg standard – 25kg large bath
  • Applicators: AP style – 2.5 – 16mm dia.
    Extended and Jet-Tip nozzles – up to 25mm dia.
    Jet-Wave nozzles – up to 25mm width
    150mm Wave nozzle
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • Flux tank capacity: 1 litre
  • Fluxer speed: 50 dots/second
  • Deposition size: 4.0-6.0mm / 0.16-0.24”
  • X, Y & Z axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen supply pressure: 5 bar / 72 psi
  • Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Air usage: 10 litres/min. / 0.35 CFM
  • Power Supplies: Single phase + PE
  • Voltage: 230V
  • Frequency: 50/60Hz
  • Power: 10.5kVA max. – machine configuration dependent
  • Transport: Conveyor

Orissa Fusion

High speed, in-line, multi-platform selective soldering system

Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
The standard four station cell can be configured to handle PCB’s up to 381mm x 460mm – fluxer, preheat, solder, solder. For high speed applications this same unit can be configured as fluxer/preheat and up to three solder modules with as many as five heater options.

Description

Product Description
An optional PCB transfer station and return conveyor enables product to be manually unloaded adjacent to the conveyor load station – this configuration reduces PCB handling capability to 381mm x 250mm.

Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

Standard Features

  • In-line motor driven width adjust through feed conveyor
  • Conveyor side clamping
  • DC servo drives with encoders on X, Y & Z axis
  • Integral PC and machine mounted TFT monitor
  • Inerted Nitrogen system
  • Automatic fiducial correction system
  • Motorised wire feed auto solder top-up & solder level detect
  • Drop-Jet fluxer
  • Solder wave height measurement and correction system
  • Process viewing camera
  • Multiple level password protection
  • Solder bath coding – identifies correct bath for program
  • Thermal nozzle calibration system using integrated setting camera (requires manual correction)
  • Six AP solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • PillarCOMM Windows® based ‘Point & Click’ interface
  • PillarPAD offline programming system
  • Lead-free compatible
  • Day-to-day service kit

Monitoring Options

  • Flux presence sensor – thermistor style
  • Flux spray, flow and spray & flow
  • Pump rpm
  • O2 ppm
  • Nitrogen flow

System Options

  • Ultrasonic fluxing
  • Dual Drop-Jet / ultrasonic fluxing
  • Top-side instant IR preheat
  • Bottom-side IR preheat
  • Closed loop pyrometer temperature control
  • Large solder bath for dedicated single dip applications
  • Laser PCB warp correction
  • 1.5mm micro nozzle
  • Solder reel identification
  • Larger PCB handling size
  • Nitrogen generator

Specifications

  • Height: 1390mm / 55” to 2045mm / 80½”- with light stack
  • Width: 2193mm / 86½“ Compact
    2930mm / 115½” Standard
  • Depth: 1520mm / 60”
    1740mmm / 68½” with flux bottles
  • Board size: 381mm x 460mm / 15”x 18” (Standard frame with 4 stations)
    Larger PCB size available upon request
  • Edge clearance: Above / below 3mm
  • Height clearance: Above / below 40mm nominal, 70mm max.
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 20kg standard – 30kg large bath
  • Applicators: AP style – 2.5 – 16mm dia.
    Extended and Jet-Tip nozzles – up to 25mm dia.
    Jet-Wave nozzles – up to 25mm width
    Special dedicated nozzles available upon request
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • X, Y & Z Axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Power supplies: Three-phase + neutral + PE
  • Voltage: 230 V phase to neutral / 400V phase to phase
  • Frequency: 50/60Hz
  • Power : Machine configuration dependent – contact your local Pillarhouse representative
  • Transport: Motorised conveyor
  • Programming: PillarCOMM Windows® based ‘Point & Click’ interface

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